Review of Electronics Packaging Issues in ITRS 2001

Chi Shih Chang, Kulicke & Soffa

Abstract:

The international technology roadmap for semiconductors (ITRS) focuses on the timeline of manufacturing readiness for various CMOS technologies and beyond. It is a worldwide semiconductor industries effort. ITRS 2001 highlights several packaging challenges, and adds the packaging requirements for a few new products (optoelectronics and MEMS). Pb-, Sb- and Br-free packaging materials require long term research and development efforts to solve processing and reliability issues. Cost of compatible PBGA and PWB materials for higher reflow temperature has to be addressed. There are potential benefits in improving the electromigration related current density and eliminating alpha particles in the solders.