Liwei Lin
Berkeley Sensor and Actuator Center
Department of Mechanical Engineering
University of California
Berkeley, California 947201 USA
E-mail: lwlin@me.berkeley.edu
Abstract:
MEMS packaging has become a major manufacturing issue for
commercialization. In the past twenty
years, the application of microelectronic technology to the fabrication of
mechanical devices stimulated emerging research in semi-conductor microsensors and
microactuators. However, research on MEMS packaging issues have been
generally neglected. This talk will introduce several thermal-bonding
processes for MEMS packaging in an effort to address the MEMS packaging
issues. These include an integrated
LPCVD nitride bonding process; localized eutectic, fusion and solder bonding
processes; RTP (rapid thermal processing) bonding processes; nano-second laser
welding process; ultrasonic sealing process; localized CVD sealing process and
low-temperature solder bonding processes.
Specific issues in MEMS packaging applications will also be discussed,
including vacuum encapsulation, accelerated testing and long-term reliability
of the encapsulated MEMS devices.