|
Date |
Topics |
Instructor |
Homework |
|
|
|
|
|
Introduction to plasma processing |
|
|
|
April 6 |
Plasma fundamentals and overview of plasma processing
in microelectronics |
Both |
|
|
|
|
|
|
Gas discharge fundamentals |
|
|
|
April 8 |
Cross-sections of electron impact processes |
F. F. Chen |
HW#1 |
|
April 13 |
Mobility, diffusion, and magnetic field effects;
desired characteristics of plasma tools |
F. F. Chen |
|
|
|
|
|
|
Plasma gas-phase and surface kinetics |
|
|
April 15 |
Conservation equations and equilibrium properties |
J. P. Chang |
HW#2
(HW#1 due)
|
|
April 20 |
Collision dynamics |
J. P. Chang |
|
|
April 22 |
Atomic collisions and spectra |
J. P. Chang |
HW#3 (HW#2 due) |
| April 27 |
Molecular collisions and spectra |
J.P. Chang |
HW#3 due |
| April 29 |
Surface reaction kinetics |
|
|
|
|
|
|
|
May 4 |
First Midterm |
|
|
|
|
|
|
|
Plasma
diagnostics (I) |
|
|
| May 6 |
Optical measurements |
J.P. Chang |
HW#4 |
|
May 11 |
Mass spectroscopic measurements |
J. P. Chang |
|
|
|
|
|
|
Plasma generation |
|
|
May13 |
Elements of plasma sources; RIE discharges |
F. F. Chen |
(HW#4 due) |
May 18 |
ECR and ICP reactors |
F. F. Chen |
HW#5 |
| May 20 |
Helicon and other high-density
sources |
F. F. Chen |
|
|
|
|
|
|
Plasma diagnostics (II) |
|
|
|
May 25 |
Electrical measurements I |
F. F. Chen |
(HW#5 due) |
May 27 |
Electrical measurements II |
F. F. Chen |
HW#6 |
|
|
|
|
|
|
June 1 |
Second Midterm |
|
|
|
|
|
|
|
Plasma applications, modeling, and future
challenges |
|
|
|
June 3 |
Plasma enhanced
deposition and etching |
J. P. Chang |
|
| June 8 |
Feature scale and
atomic scale modeling |
Both |
|
June 10 |
Current
developments and furture challenges |
Both |
HW#6 due |
|
|
|
|
| June 17 |
Final project
or report due |
|
|
