MRS 2000 Spring Meeting
Symposium B: Si Front End Processing - Physics and Technology of Dopant-Defect-Interactions
ION IMPLANTATION EFFECT ON DISLOCATION PROPAGATION IN PSEUDOMORPHICALLAY STRAINED P/P+ SILICON
P. Feichtinger, H. Fukuto, R. Sandhu, B. Poust, and M.S. Goorsky, Dept of Materials Science and Engineering, University of California, Los Angeles; D. Oster, S.F. Rickborn, and J. Moreland, Wacker Siltronic Corporation, Portland, OR.
We studied damage evolution and influence on defect interactions as a function
of Si self implantation in p/p+ silicon wafers. Si-28 (doses 1 x 1012 and
1 x 1014 cm-2 at 100 keV) was implanted into nominally
un-doped p-type epitaxial layers. We employed highly boron doped 150 mm diameter
silicon substrate wafers with a 2 mm thick pseudomorphic epitaxial layer (p/p+).
Due to the misfit strain, misfit dislocations formed during the epitaxial growth
process around the wafer edges. This non-uniform dislocation distribution was
utilized to study the role of the implant on both the nucleation and growth
of the misfit segments. The silicon self implantation was performed at room
temperature. A simulation program was used to study the point defect distribution
during the implantation process. Triple axis x-ray diffraction was used to determine
that the layer was not amorphous at any point. Double axis x-ray topography
combined with rapid thermal annealing was used to measure the evolution and
nucleation of the misfit segments after annealing. SRP measurements were done
in both implanted and un-implanted regions before and after ion implantation
in order to characterize the carrier concentration profile. SIMS measurements
confirmed that transient enhanced diffusion of boron was not appreciably different
in the two regions. The implanted regions exhibited neither growth nor nucleation
of misfit dislocation segments, in marked contrast to the growth and nucleation
of misfits observed in the non-implanted regions. This comparison indicated
that the excess point defects and crystallographic damage act to impede both
dislocation motion and dislocation nucleation.