K. N. Tu, "Contact Reactions in SOI," Department of Chemical, Bioengineering and Materials Engineering, ASU, Tempe, Arizona, November 5, 1993 (Invited Talk)

K. N. Tu, "Electromigration in Stressed Thin Films," Department of Electrical and Computer Engineering," University of California, San Diego, November 19, 1993. (Invited Talk)

K. N. Tu, "Silicide Formation in SOI," Motorola, Mesa, Arizona, March 24, 1994 (Invited Talk)

K. N. Tu, "Reliability of Pb-Free Solders," SRC Packaging Program Review, Atlanta, January 13-14, 1994, (Invited Talk)

K. N. Tu, "Instability of Wetting Tip and Interface in Soldering Reactions," National Nano-Device Laboratory, Taiwan, December 15, 1994. (Invited Talk)

K. N. Tu, "Instability of Wetting Tip and Interface in Soldering Reactions," National Tsing Hua University, Taiwan, December 13, 1994. (Invited Talk)

K. N. Tu, "Wetting Kinetics of SnPb Solders," IBM T.J. Watson Research Center, Yorktown Heights, New York, July 28, 1995. (Invited Talk)

K. N. Tu, "Spontaneous Sn Whisker Growth on Sn/Cu Bimetallic Thin Films, 1995 TMS Annual Meeting, Las Vegas, February 13-15, 1995. (Invited Talk)

K. N. Tu, "Irreversible Processes in Thin Films," Department of Materials Science and Engineering, USC, Los Angeles, March 31, 1995 (Invited Talk)

K. N. Tu, "Wetting Kinetics and Aging of Lead-Based and Lead-Free Solders," Workshop on Lead-Free Solders, Northwestern University, Evanston, IL, July 24-26, 1995. (Invited Talk)

K. N. Tu, "Electromigration in Cu and Cu(Sn) Thin Films," Center for Solid State Science, Arizona State University, Tempe, AZ, September 18, 1995 (Invited Talk)

K. N. Tu, "Electrical Transport Properties of Silicide Single Crystals and Thin Films," 1995 TMS Fall Meeting, Cleveland, October 30, 1995 (Invited Talk)

K. N. Tu, "Silicide for Integrated Circuits: Materials Aspects," 1995 MRS Fall Meeting, Boston, November 27, 1995 (Invited Talk)

K. N. Tu, "Cu-Sn Reactions: "Thin Film Case vs. Bulk Case," JIM '95 Fall Annual Meeting, Hawaii, December 14, 1995 (a keynote talk)

K. N. Tu, "Soldering Reaction in Electronic Packaging," Institut für Festkorper-und Werkstofforschung, Dresden, Germany, October 1996. (Invited)

K. N. Tu, "Electromigration Behavior of Cu(Sn) Thin Film Interconnects," 1996 TMS Spring Meeting, Anaheim, CA, February 1996. (Invited)

K. N. Tu, "Interaction of Interconnect Materials with Substrate and Substrate Coatings," 1996 IMM Workshop on Interconnects, Evanston, August 19-21, 1996.(Invited)

K. N. Tu, "Electromigration in Stressed Thin Films," School of Engineering, Christian-Albrechts-University, Kiel, Germany, October 1996. (Invited)

K. N. Tu, "Dopant Activation in Heavily-Doped Si by High Current Density," Fudan University, Department of Microelectronics, Shanghai, China, November 1996.(Invited)

H. K. Kim and K. N. Tu, "Spalling of Cu-Sn Compound Spheroids in Solder Joints on Si Wafers," 1996 MRS Fall Meeting, Boston, December 2-6, 1996. (Invited)

K. N. Tu, "Kinetics of Ripening in Soldering Reactions," 1997 Golden Gate Meeting, San Francisco, February 27. (Invited)

K. N. Tu, "Electromigration in stressed Thin Films," Department of Materials Science and Engineering, North Carolina State University, March 5, 1997.(Invited)

K. N. Tu, "Novel Dopant Activation in Heavily-Doped Si by High Current Density," Bohnische Physical Society Meeting, Arizona State University, Tempe, June 20, 1997 (Invited)

K. N. Tu, J. M. Liang, L.-J. Chen, and L. T. Shi, "Morphology and Kinetics of Crystallization of Amorphous CoSi₂ Thin Films," 1997 TMS David A. Smith Symposium on Boundaries and Interfaces in Materials, Indianapolis, September 15-18, 1997. (Invited)

K. N. Tu, H. K. Kim, and P.A. Totta, "Ripening-Limited Intermetallic Compound Formation in Soldering Reactions," 1997 TMS Fall Meeting, Indianapolis, September 14-18, 1997. (Invited)

K. N. Tu, "Spalling of Cu-Sn Intermetallic Compounds in Solder-UBM Reactions," 1998 TMS Spring Meeting, San Antonio, February 16-19, 1998. (Invited)

K. N. Tu, "Stress in Thin Film Electromigration," 1998 Germany Physical Society Meeting, Regensburg, Germany, March 25, 1998. (Invited)

K. N. Tu, "Soldering Reactions in Electronic Packaging," 1998 MRS Spring Meeting, San Francisco, April 13-17, 1998. (Invited)

K. N. Tu, "Ripening Assisted Soldering Reaction in Flip-Chip Technology," DIFTRANS'98, Cherkasy, Ukraine, June 24, 1998. (Invited)

K. N. Tu, "Ripening Assisted Soldering Reaction in Flip-Chip Technology," Materials Research Laboratory, ITRI, Tsinchu, Taiwan, ROC, July 3, 1998. (Invited)

K. N. Tu, "Metallurgical Issues in VLSI Interconnects," LLNL, San Francisco, September 15, 1998. (Invited)

K. N. Tu, "Electromigration in solder Joints," Intel, Santa Clara, October 2, 1998. (Invited)

K. N. Tu, "Metallurgical Issues in Flip-Chip Technology," Topical Research Conference on reliability, Austin, October 26, 1998. (Invited)

K. N. Tu, "Ripening Assisted Solder Reactions in Flip-Chip Technology," IBM East Fishkill Facility, East Fishkill, New York, October 5, 1998. (Invited)

K. N. Tu, "Metallurgical issues in flip chip technology," 1999 TMS Spring meeting, San Diego, CA, March 1, 1999. (Invited)

K. N. Tu and P. G. Kim, "Electroless Ni UBM for low cost flip chip technology," IMAPS Conference, Atlanta, GA, March, 17, 1999. (Invited)

K. N. Tu, "Metallurgical issues in flip chip technology," Intel, Santa Clara, CA, May 19, 1999. (Invited)

K. N. Tu, "Electromigration in thin films," Goettingen University, Goettingen, Germany, July 9, 1999. (Invited)

K. N. Tu, "Electromigation in thin films," Max-Planck Institute fur Metallforschung, Stuttgart, Germany, July 15, 1999. (Invited)

K. N. Tu, "Metallurgical issues in flip chip technology," Packaging Research Center, Georgia Institute of Technology, Atlanta, GA, Oct. 21, 1999. (Invited)

K. N. Tu, "Contact electromigration," 3^rd International Symposium on Control of Semiconductor Interfaces, Karuizawa, Japan, Oct. 25-29, 1999. (Invited)

K. N. Tu, "Electromigration in SnPb solder alloys," 1999 TMS Fall meeting, Cincinnati, PA, Nov. 1-3, 1999. (Invited)

K. N. Tu, "Interfacial reaction between molten solder and thin solid films in flip chip technology," TMS annual meeting at Nashville, TN, March 13, 2000. (invited)

K. N. Tu, "Effect of current crowding on electromigration," Max-Planck-Institute for Metallurgy, Stuttgart, Germany, April 5, 2000. (invited)

K. N. Tu, "Electromigration in stressed thin films," Nuclear Research Institute, Debrecan, Hungary, April 10, 2000. (invited)

K. N. Tu, "Metallurgical reliability issues in flip chip technology," Dept. of materials Science and Engineering, RPI, Troy, NY, April 27, 2000. (invited)

K. N. Tu, "Interfacial reaction and electromigration in Pb-based and Pb-free solders, " IBM East Fishkill Facilities, East Fishkill, NY, April 28, 2000. (invited)

K. N. Tu, "Reliability issues in flip chip technology," Nokia Research Center, Helsinki, Finland, August 24, 2000. (invited)

K. N. Tu, "Inhomogeneous stress-strain issues in VLSI interconnects," Workshop of Synchrotron Radiation at Advanced Light Source, Lawrence Berkeley National Laboratory, Berkeley, CA, October 22, 2000. (invited)

K. N. Tu, "Solder reactions in flip chip technology," TMS Annual meeting, New Orleans, LN, February 13, 2001 (invited)

C. Y. Liu, and K. N. Tu, "Electromigration in Sn-Pb solder alloys as a function of composition," TMS Annual meeting, New Orleans, LN, February 14, 2001 (invited).

K. N. Tu, "Electromigration in flip chip solder joints," Sun Microsystems, Santa Clara, February 15, 2001 (invited).

K. N. Tu, "Chip packaging metallurgy research," Intel Corporation, Phoenix, AZ, February 20, 2001 (invited).

K. N. Tu, "Electromigration in VLSI interconnects," Dept. of Chemical and Environmental Engineering, UC Riverside, Riverside, CA, April 9, 2001. (invited).

K. N. Tu, "Reliability issues in microelectronic packaging technology," Lightcross Company, Pasadena, CA, April 24, 2001 (invited).

K. N. Tu, "Reliability issues concerning the use of Pb-free solders in microelectronic packaging technology," IBM East Fishkill, NY, April 26, 2001. (invited).

K. N. Tu, "Solder reactions," Faculty of Engineering, Christian-Albrechts University of Kiel, Germany, June 12, 2001 (invited).

K. N. Tu, "Electromigration in VLSI interconnects," Christian-Albrechts University of Kiel, Germany, June 19, 2001 (invited).

K. N. Tu, "Ripening-controlled interfacial reactions," 2nd International workshop on Diffusion and Diffusional Phase Transformations in Alloys, Cherkasy, Ukraine, June 24-July 1, 2001. (invited)

K. N. Tu, " Morphology stability of IMC in solder reactions," International Conference on Materials for Advanced Technologies, Singapore, July 1-6, 2001. (invited)

K. N. Tu, "Simulation of current crowding in electromigration of in VLSI interconnects," International Conference on Materials for Advanced Technologies, Singapore, July 1-6 2001. (invited)

K. N. Tu, "Electromigration in Pb-free flip chip solder joints," AMD, Santa Clara, CA, Sept. 26, 2001 (invited).

K. N. Tu, "Electromigration in Pb-free flip chip solder joints," Advanced Semiconductor Engineering, Santa Clara, CA, Sept. 26, 2001 (invited).

K. N. Tu, T. Y. Lee, W. J. Choi, N. Tamura, L. Nguyen, " Synchrotron radiation, XTEM study of Sn whisker growth on Pb-free coated leadframe," 2001 TMS Fall Meeting, Indianapolis, IN, Nov. 5, 2001 (invited).

K. N. Tu, "Electromigration in VLSI interconnects, " Engineering Foundation Conference, Lake Arrowhead , CA, Nov. 14, 2001 (invited).

K. N. Tu, "Reliability issues in Pb-free electronic packaging manufacturing," EPA Center, City University of Hong Kong, Dec. 10, 2001 (invited).

K. N. Tu, "Sn whisker growth on Pb-free coated leadframes," Macronix International Company, Ltd., Hsinchu, Taiwan, ROC, Dec. 14, 2001 (invited).

K. N. Tu, "Electromigration in VLSI interconnects," Dept. of Physics and Materials Science, City University of Hong Kong, Dec. 18, 2001 (invited).

K. N. Tu, "Effect of current crowding on electromigration in VLSI interconnects," 2002 TMS Spring Meeting, Seattle, Feb. 17-21, 2002 (invited).

Hua Gan and K. N. Tu, "Polarity effect of electromigration on intermetallic compound formation in solder v-groove samples," 2002 TMS Spring Meeting, Seattle, Feb. 17-21, 2002 (invited).

Kejun Zeng and K. N. Tu, "Reliability issues of Pb-free soldering caused by metallurgical reactions," 2002 TMS Spring Meeting, Seattle, Feb. 17-21, 2002 (invited).

K. N. Tu, "Ripening-controlled solder interfacial reactions," 2002 TMS Spring Meeting, Seattle, Feb. 17-21, 2002 (invited).

K. N. Tu, ¡°Reliability issues of Pb-free solders,¡± Dept. of Electrical Engineering, City University of Hong Kong, March 19, 2002 (invited).

K. N. Tu, ¡°Electromigration in VLSI interconnects, ¡° Dept. of Electronic Engineering, Fudan University, Shanghai, March 22, 2002 (invited).

K. N. Tu, ¡° Electromigration in VLSI interconnects, ¡° Dept. of Materials Science and Engineering, Johns Hopkins University, March 27, 2002 (invited).

K. N. Tu and K. Zeng, ¡°Reliability issues of Pb-free solder joints in electronic packaging tehnology, ¡° 52nd Electronic Component and Technology Conference, San Diego, CA, May 31, 2002 (invited).

K. N. Tu, ¡°Electromigration in VLSI interconnects,¡± School of Materials Engineering, Nanyang Technological University, Singapore, Sept. 12, 2002 (invited public lecture).

K. N. Tu, ¡°Electromigration in flip chip solder joints,¡± School of Materials Engineering, Nanyang Technological University, Singapore, Sept. 17, 2002 (invited).

K. N. Tu, ¡°Electromigration in VLSI interconnects¡± and ¡°Synchrotron radiation, FIB, and XTEM study of Sn whisker growth on leadframe finish,¡± Chartered Semiconductor Manufacturing, Singapore, Sept. 18, 2002 (invited).

K. N. Tu, ¡°Electromigration in flip chip solder joints¡± and ¡°Synchrotron radiation, FIB, and XTEM study of Sn whisker growth on leadframe finish¡± IME Workshop, Sept. 11, 2002 (invited).

K. N. Tu, Gu Xu, Hua Gan, Woojin Choi, ¡°Electromigration in solder joints and solder lines,¡± TMS 2002 Fall Meeting, Columbus, OH, October 9, 2002 (invited).

Woojin Choi and K. N. Tu, ¡°Sn whisker growth studied by synchrotron radiation micro x-ray diffraction,¡± LBNL/ALS User Annual Meeting, Berkeley, CA, October 10, 2002 (invited).

K. N. Tu, ¡°Stress induced by electromigration in VLSI interconnects,¡± 2002 ASME International Mechanical Engineering Congress & Exposition, New Orleans, LA, November 20, 2002 (invited).

K. N. Tu, ¡°Electromigration in VLSI interconnects,¡± MSE Departmental Seminar, UCLA, Oct. 18, 2002 (Invited).

K. N. Tu, ¡°Physics and materials challenges of Pb-free solders,¡± City University of Hong Kong, December 6, 2002 (invited public lecture).

K. N. Tu and W. J. Choi, ¡°Focused ion beam, cross-sectional TEM and synchrotron radiation study of Sn whisker growth,¡± Workshop on Sn Whisker Growth, organzied by NIST at 132nd Annual Meeting of TMS, San Diego, March 2-6, 2003.

Chel-Jong Choi, Tae-Yeong Seong, Hua Gan, Grant Pan, and K. N. Tu, ¡°Effect of amorphous-to-crystalline transformation of Si on the redistribution of NiSi2,¡± 132nd Annual Meeting of TMS, San Diego, March 2-6, 2003.

J. S. Kim, and K. N. Tu, ¡°Horizontal and vertical flow of molten Pb-free solders along V-grooves on Si,¡± 132nd Annual Meeting of TMS, San Diego, March 2-6, 2003.

K. N. Tu, ¡°Electromigration induced phase changes in solder joints and lines,¡± 132nd Annual Meeting of TMS, San Diego, March 2-6, 2003.

K.N. Tu, ¡°Focused ion beam, cross-sectional TEM and synchrotron radiation study of Sn whisker growth,¡± Aerospace Corporation, Torrance, CA, March 21, 2003.

Albert Wu and K. N. Tu, ¡°Manufacturing reliability issues in Pb-free solders in electronic Packaging,¡± UC SMART Workshop on Benign Manufacturing at UCI, Irvine, CA, April 3, 2003.

K. N. Tu, ¡°Interfacial reaction in Pb-free solder joints,¡± Intel, Santa Clara, CA, April 16, 2003.

Hua Gan and K. N. Tu, ¡°Electromigrtion in flip chip solder joints,¡± The 53rd Electronic Components and Technology Conference,¡± New Orleans, May 24 to June1, 2003.

K. N. Tu, ¡°Stress induced by electromigraion in VLSI interconnects,¡± Naval Post-Graduate School, Monterey, CA Aug. 21, 2003.

K. N. Tu, ¡°Electromigration in flip chip solder joints,¡± SEMATECH TRC meeting, Austin TX, Oct. 28, 2003.

M. Date, T. Shoji, M. Fujiyoshi, K. Sato, and K. N. Tu, ¡°Impact reliability of Pb-free solder joints,¡± 2003 TMS Fall Meeting, Chicago.

K. N. Tu, ¡°Electromigration in flip chip solder joints,¡± and ¡°mechanism of Sn whisker growth in Pb-free finish,¡± ISTFA, Santa Clara, Nov. 2, 2003.

K. N. Tu, ¡°Electormigration in flip chip solder joints,¡± SRC eWorkshop Lecture, UCLA, Nov. 10, 2003.

Yuhaun Xu, Emily Ou, Gu Xu, and K. N. Tu, ¡°Precision optical packaging of v-grooved fiber array by Pb-free solder,¡± ICMAT, Singapore, 7-12 December 2003.

K. N. Tu, A. M. Gusak, and I. Sobchenko, ¡°Kineitc theory of flux-driven grain growth in thin film deposition,¡± ICMAT, Singapore, 7-12 December 2003.

A.M. Gusak and K. N. Tu, ¡°Kinetic theory of flux-driven ripening,¡± ICMAT, Singapore, 7-12 December 2003.

K. N. Tu, ¡°Electromigration in flip chip solder joints,¡± ICMAT Singapore, 7-12 December 2003.

K. N. Tu, ¡°Thin film applications in microelectronic devices,¡± School of Microelectronics, Fudan University, Shanghai, POC, Dec. 15, 2003.

K. N. Tu, ¡°Recent advances on electromigration in very-large-scale-integration of interconnects,¡± COE United Approach to New Materials Science Conference, Osaka, Japan, Feb. 03, 2004.

K. N. Tu, ¡°Mechanism of Sn whisker growth¡±, Institute of Scientific and Industrial Research, Osaka University, Japan, Feb. 02, 2004.