I. Simulation of Effects of Current Crowding and Contact Resistance on Electromigration in VLSI Interconnects
II. Morphology, Kinetics, and Thermodynamics of Wetting Reaction and Solid State Reaction between Sn-based Solders and Cu
III. Low Dielectric Constant Porous Thin Film
IV. Synchrotron Radiation Study of Sn Whisker Growth on Pb-free Solder Finish
V. Focused Ion Beam and Transmission Electron Microscope Study of Sn Whisker Growth on Pb-free Solder Finish
VI. The Polarity Effect of Electromigration on Intermetallic Compound (IMC) Formation at Solder-Copper Interfaces
VII. Precision Optical Packaging of V-grooved Fiber Array by Lead-free Solder
VIII. Morphology Change of Intermetallic Compound formed by wetting reaction between SnPb alloys and Cu
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