Program

8:00 am to 8:50 am
Registration and Continental Breakfast

8:50 am to 9:00 am
"Welcome," Associate Dean Michael K. Stenstrom, HSSEAS, UCLA

Morning Session
Session Chairs: Jim Lloyd, IBM Research, Yorktown Heights, NY
                          Fay Hua, Intel Corp., Santa Clara, CA

9:00 am to 9:20 am
Paul Totta, East Fishkill, NY   Abstract
"Forty Years of Flip Chips with Solder Bumps"

9:20 am to 9:40 am
Carol Handwerker, NIST, Washington DC  Abstract
"NIST program on Pb-free solder"

9:40 am to 10:00 am
Chi-Shih Chang, Kulicke & Soffa, Austin, TX  Abstract
"Review of electronic packaging issues in 2001 International Technology Roadmap for Semiconductors"

10:00 am to 10:20 am
Srinivas Rao, Solectron, Milpitas, CA  Abstract
"The No-Lead Manufacturing Initiative at NEMI"

10:20 am to 10:50 am Coffee-break

10:50 am to 11:10 am
Julie Schoenung, UC Davis, CA  Abstract
"Toxicity, availability and extraction of the metals used in Pb-free solder"

11:10 am to 11:30 am
Kirk Bonner and Linda Del Castillo, JPL, Pasadena, CA  Abstract
"Choosing the Right Lead-free Solder for Hi-Rel Printed Wiring Assemblies "

11:30 am to 11:50 am
Paul T. Vianco, Sandia, Albuquerque, NM.   Abstract
"Compression Stress/Strain Response of the 95.5Sn-3.5Ag-0.6Cu Solder"

11:50 am to 2:00 pm Lunch (UCLA Faculty Center) & Poster Session

Afternoon Session
Session Chairs: William Chen, ASE, Santa Clara, CA
                          I. Datta, Naval Postgraduate School, Monterey, CA

2:00 pm to 2:20 pm
John Morris Jr., UC Berkeley  Abstract
"The Microstructure and Creep Properties of Pb-Free Solder Joints"

2:20 pm to 2:40 pm
N. Tamura, LBNL, Berkeley, CA  Abstract
"Synchrotron radiation X-ray microdiffraction study of Pb-free solders"

2:40 pm to 3:00 pm
Yifan Guo, Skyworks Solutions, Newport Beach, CA  Abstract
"Mechanical reliability of flip chip interconnection in Pb-free systems"

3:00 pm to 3:20 pm
Michael Shaw, California Lutheran University, Thousand Oaks, CA   Abstract
"Effects of Viscoplasticity on Perimeter Stress Distributions and Reliability in Multilayered, Ductile/Brittle Electronic Packages"

3:20 pm to 3:50 pm Coffee-break

3:50 pm to 4:10 pm
K. N. Tu, UCLA,  Abstract
"Electromigration in Pb-free solder joints and lines"

4:10 pm to 4:30 pm
C. C. Lee, UC Irvine,CA  Abstract
"Fluxless Soldering Technology for MEMS and Photonics"

4:30 pm to 4:50 pm
Fay Hua, Intel, Santa Clara CA  Abstract
"Pb-free Solder Challenges in Electronic Packaging and Assemblies"

4:50 pm to 5:10 pm
S. K. Kang, IBM T. J. Watson Research Center, Yorktown Heights, NY  Abstract
"Recent Progress in Pb-Free Solders and Soldering Technologies"

5:10 pm to 5:30 pm
Jim Lloyd, IBM T.J. Watson Research Center, Yorktown Heights, NY Abstract
"Interesting Behavior in Sn During Electromigration Testing"

5:30 pm to 6:30 Cocktail Party & Poster Session

6:30 pm Dinner (UCLA Faculty Center)

8:30 am to 9:00 am
Registration and Continental breakfast

Morning Session
Session Chairs: Atila Mertol, LSI Logic, Milpitas, CA
                          Robert Kao, National Central University, Chengli, Taiwan

9:00 am to 9:20 am
Sungho Jin, UCSD,   Abstract
"Universal solder for optical and MEMS packaging"

9:20 am to 9:40 am
Liwei Lin, UC Berkeley, CA  Abstract
"Packaging issues of MEMS devices"

9:40 am to 10:00 am
John Lau, Agilent, Santa Clara, CA  Abstract
"Nonlinear Analysis of the Lead-Free Solder Sealing Ring of a Photonic Switch "

10:00 am to 10:20 am
Tsung-Yu Pan, Ford Research lab., Dearborn, MI  Abstract
"Pb-free solder applications and requirements in automotive industry"

10:20 am to 10:50 am Coffee-break

10:50 am to 11:10 am
Darrel Frear, Motorola, Tempe, AZ  Abstract
"Pb-free Solder Interconnects for Flip Chip and Area Array Interconnects "

11:10 am to 11:30 am
Weiqun Peng, Viswam Puligandla, Steve Dunford, and Stephen Quander, Nokia Research Center, Dallas, TX Abstract
"Microstructural aspects and performance implications of Sn-Ag-Cu solder in the presence of Au"

11:30 am to 11:50 am
Donald C. Abbott, TI, Attleboro, MA.  Abstract
"NiPd Finishes for Pb-Free Leaded Components"

11:50 am to 1:30 pm Lunch (UCLA Faculty Center)

Afternoon Session
Session Chairs: K. N. Tu, UCLA, Los Angeles, CA
                          Paul A. Totta, East Fishkill, NY

1:30 pm to 2:00 pm
Dr. Julie Stein, "UC SMART program overview"

2:00 pm to 4:00 pm
Round Table Discussion

Is industry ready for Pb-free solder manufacturing?

What are the key yield and reliability issues?

What are the Pb-free solder challenges for future research in UC?

To explore the possibility of forming a UC Center on Packaging Science and Technology

To present a plan on M. Sc. degree of electronic packaging to be offered by Dept. of MSE at UCLA (Prof. Jenn-Ming Yang)