Our research interest is in wafer-based and flux-driven materials science. Modern microelectronic, opto-electronic, bio-sensor, and MEMS devices are built on wafers, involving the growth or removal of mono-layers of atoms from the wafer surface or an inter-phase interface. We deal with open systems, in which the flux can be atoms or energy beams.

Our major research areas are (1) Reliability science of interconnects in chip and packaging technology, (2) Joule heating and heat dissipation in 3D IC technology, and (3) Kinetic theory of interdiffusion and reactions to form intermetallic compounds; the chemical effect on intrinsic diffusivity will be emphasized.